Categories: Wire Stories

Fujikura: Development of High-performance Heat Pipe for Data Center Cooling

TOKYO–(BUSINESS WIRE)–Fujikura Ltd. (Director, President and CEO, Naoki Okada)(TOKYO:5803) has developed a high performance heat pipe for data center cooling application. Newly developed heat pipe has doubled the maximum heat transfer capacity compared with our conventional products.


In data centers, server CPUs are becoming more powerful as 5G and AI become more widespread, leading to faster communications. The more powerful a CPU, the more heat it generates, and the more cooling it needs to perform up to its full potential. To address this cooling issue, a high-performance liquid cooling system works well, but such system requires very high infrastructure cost. To avoid the high cost, there is a trend of extending the usage of inexpensive but high performance air cooling solutions. High performance heat pipe is required for the air cooling systems.

A heat pipe is an evacuated and sealed container charged with a small quantity of working fluid. Without the assistance of any external force, a heat pipe can transfer heat from one end to other by the repeated action of vaporization and condensation. New wick structure is developed to enhance the performance of traditional heat pipe. Maximum heat transfer capacity of the new heat pipe (original diameter 8mm and flattening thickness 4mm) reached to 100[W] compared to that of the conventional types 55[W].

We will continue to meet customer’s expectations and contribute to the further development of information and communications infrastructure by improving the performance of cooling modules.

[Explanation of Terms]

• Heat pipe

Heat pipe is recognized as a well-known passive two phase heat transfer device. Basically, heat pipe consists of an evacuated and sealed metal container charged with a small quantity of working fluid. When heat is input in one end of the heat pipe vaporization of the liquid occurs and due to the pressure difference the generated vapor moves to the other end of the heat pipe where it condensed back to liquid by releasing the latent heat; then condensed liquid returns to the heating section via the wick structure which is attached along the container of the heat pipe. Because of the repeated action of vaporization and condensation heat is transferred from one end to the other without the assistance of any kind of external force.

Contacts

Thermal technology department

e-mail: fjk.thermal@jp.fujikura.com

Alex

Recent Posts

Hong Kong Tech Delegation Heading for Market Expansion at Mobile World Congress 2026

Debut at startup-centric zone 4YFN, Dual-presence at World Class Tech Exhibitions in SpainHONG KONG SAR…

18 hours ago

Ramadan Made Easier: Plan Every Ramadan Meal with Shopee, from Sahur to Iftar

KUALA LUMPUR, MALAYSIA - Media OutReach Newswire - 23 February 2026 – As Ramadan approaches,…

2 days ago

Lumen Technologies expands APAC cybersecurity capabilities in collaboration with Palo Alto Networks

SINGAPORE - Media OutReach Newswire - 23 February 2026 - Lumen Technologies has achieved the…

2 days ago

Anaplan Launches AWS Data Center in Singapore to Enhance Global Reach and Support Local Enterprises

New location expands company’s global infrastructure, while offering faster data processing, robust security measures and…

2 days ago

Trad To Tech: Craftsmanship Growing Inside the Most Beautiful Homes as MIFF Leads the Way

KUALA LUMPUR, MALAYSIA - Media OutReach Newswire - 23 February 2026 - At the Malaysian…

2 days ago

Keeper Security Expands Relationship With Ingram Micro to Broaden Availability of Privileged Access Management in Singapore

Expansion strengthens cybersecurity resilience by delivering a modern, scalable privileged access solutionSINGAPORE - Media OutReach…

2 days ago