TSMC Files Annual Report on Form 20-F for 2023

HSINCHU, Taiwan–(BUSINESS WIRE)–TSMC (TWSE: 2330, NYSE: TSM) today filed its 2023 annual report on Form 20-F with the U.S. Securities and Exchange Commission.

The report is available at https://investor.tsmc.com/english/sec-filings. Hard copies of the report are also available, free of charge, upon email request to p_sec_service@tsmc.com.

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

Contacts

TSMC Spokesperson:
Wendell Huang

Senior Vice President and CFO

Tel: 886-3-505-5901

Media Contacts:
Nina Kao

Head of Public Relations

Tel: 886-3-563-6688 ext.712-5036

Mobile: 886-988-239-163

E-Mail: nina_kao@tsmc.com

Ulric Kelly

Public Relations

Tel: 886-3-563-6688 ext.712-6541

Mobile: 886-978-111-503

E-Mail: ukelly@tsmc.com