Beginning mass production and shipment for a multi-chip module manufacturer in January 2021
TOKYO--(BUSINESS WIRE)--For the commercialization of HRDP�1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, �Mitsui Kinzoku�) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP� has started for a domestic multi-chip module manufacturer.
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP�, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2.
HRDP� is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 ?m or less4. Currently, over 20 customers are evaluating HRDP� for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP� to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP� within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP� market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers� wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1 Abbreviation of High Resolution De-bondable Panel
2 Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3 Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4 L/S=2/2 �m: The line width of 2 �m and the space between neighboring circuit lines of 2 �m.
5 Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6 High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP� Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP�
https://www.youtube.com/watch?v=vHhng-NV9QA
Contacts
[Contact for inquiries about this release and HRDP� products]
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
Mr. KASAHARA Norio
TEL: +81-3-5437-8028 E-mail: [email protected]
[Contact for Inquiries about HRDP� products] (Native language is available.)
In China
EVER TEAM TECHNOLOGY (NANJING) CO., LTD.
Mr. Jordon Jiang
TEL: +86-18601423513 E-MAIL: [email protected]
In Taiwan
EVER TECH INSTRUMENTAL CO., LTD
Mr. Alvin Tu
TEL: +886-915973025 E-MAIL: [email protected]
In Korea
AJ COMPANY
Mr. Suh Jeong Wook
TEL: +82-1053711563 E-MAIL: [email protected]
